Will MediaTek's Dimensity 1050 5G be the new middle-class ruler
According to reports, MediaTek is working on a new SoC that will shake up the mid-range Android smartphone industry. It is a Dimensity 1050 SoC, which is an octa-core processor with a 6-nanometer architecture.
MediaTek's smartphone processors were still in their beginnings a few years ago, thus they were unfamiliar. If you purchased a new Android smartphone six or more years ago, you were most likely looking for one with Snapdragon, Exynos, or Helio processors, all of which are found in Huawei handsets.
But that is no longer the case. Because of its excellence, which has been recognized by an increasing number of users and consumers over time, MediaTek as a brand has grown and spread to a rising number of devices bearing the Android logo. This year, we should get something even better, a CPU that should deliver even more benefits than a solid brand.
Mediatek Dimensity SoCs are gaining popularity as they are responsible for the firm earning a large market share. The Taiwanese chipmaker is now increasing its portfolio with the introduction of the MediaTek Dimensity 1050, another great chipset.
The chipset is a lower-specified variant of the Dimensity 1100 SoC in terms of functionality and features. However, it was also the first chipset in the company's history to include a 5G connection below 6 GHz and dual mmWave.
The Dimensity 1050 is effectively an octa-core processor with two 2.5 GHz ARM Cortex-A78 performance cores and a 6-nanometer architecture. Although the business has not specified the number of cores in charge of the economy, it is likely to be six ARM Cortex-A55.
The processor will also have an ARM Mali-G610 graphics processor for efficient graphics processing. It works with MediaTek's HyperEngine 5.0 suite, giving you access to additional optimization tools and seamless features for an unrivaled gaming experience.
It also supports an HD + resolution screen with a 144Hz refresh rate, hardware-accelerated AV1 video decoding, HDR10 + playback, and Dolby Vision.
The chip supports 3CC carrier aggregation for spectrum below 6GHz (FR1) and 4CC carrier aggregation for mmWave (FR2). It is also thought to give a 53 percent quicker incoming connection speed than the LTE + mmWave combination.
It should also be noted that the SoC is completely compatible with Wi-Fi 6E and 2 2 MIMO antennas, allowing for lightning-fast Wi-Fi networking.
This year's launch is planned to take place between July and September. While the business hasn't revealed any other information about the chip, we're looking forward to its debut, as other speculations suggest that the new Dimensity SoC might be the new ruler in mid-range smartphones using the Android operating system.
We hope to find out soon whether this is truly the case, and that there will be no unforeseen "delays" in the production and installation of the new SoC in new, future smartphones.
